| Procured Items Information |
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Miyoshi Electronics purchases the materials and facilities for telecommunication and Electronics devices , as we manufacture them. Please send us your latest information of component parts and facilities, etc. |
| *For inquiries and reference of procurement items, please click on the description of the item(usage) to open the email page. |
| Type | Usage(details) | Application | ||
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Telecomm- unication Division |
Electronics Devices Division |
Facilities etc. |
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| 1 | Electronics Components | .1. Printed-circuit board |
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| .2. High-density mounting board such as LTCC, BUILD-UP |
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| .3. Component parts for printed-circuit board mounting |
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| .4. Component parts for information telecommunication equipments |
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| .5. ASIC for communication equipments |
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| 3 | Ceramic board and pastes for thick film resistance board | 14. For power supply control |
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| 15. For portable telecommunications equipment |
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| 16. For car electrical component parts IC |
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| 17. Conductor, resistance, and cross glass paste |
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| 18. The overcoat glass etc. |
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| 4 | Development support | 19. Communication equipments / contract development of hardware |
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| 20. Electronics devices circuit design |
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| 21. Contract software development |
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| 5 | Packing material for products | 22. Individual case and carton box for product shipment |
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| 23. Packing material for product shipment |
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| 24. Conductor bags, Plastic bags |
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| 25. Trays |
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| 26. User manuals |
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| 6 | Plant facilities | 27. Telecommunication equipments, thick film resistance circuit board, LCD module mounting, assembly facilities |
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| 28. Facilities in general for various semiconductor assemblies |
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| .. -home- |