Miyoshi Electronics purchases the materials and facilities for telecommunication and Electronics devices , as we manufacture them.
Please send us your latest information of component parts and facilities, etc.
*For inquiries and reference of procurement items, please click on the description of the item(usage) to open the email page.
Type Usage(details) Application
Telecomm-
unication
Division		 Electronics
Devices
Division		 Facilities
etc.
1 Electronics Components .1. Printed-circuit board dot.gif
.2. High-density mounting board such as LTCC, BUILD-UP dot.gif dot.gif
.3. Component parts for printed-circuit board mounting dot.gif dot.gif
.4. Component parts for information telecommunication equipments dot.gif
.5. ASIC for communication equipments dot.gif
2 Resin cases, metal processed parts, and cable assembled products .6. Resin cases for communication equipments dot.gif
.7. Resin cases , sheet metal cases for office equipments dot.gif
.8. Resin cases , sheet metal cases for industrial equipments dot.gif
.9. Precision sheet metal processed products dot.gif dot.gif
10. Metal heat dissipation board dot.gif dot.gif
11. Metal, resin housing dot.gif dot.gif
12. Metal work for tooling jig and facilities dot.gif dot.gif
13. Cable assembly for circuit board dot.gif
3 Ceramic board and pastes for thick film resistance board 14. For power supply control dot.gif
15. For portable telecommunications equipment dot.gif
16. For car electrical component parts IC dot.gif
17. Conductor, resistance, and cross glass paste dot.gif
18. The overcoat glass etc. dot.gif
4 Development support 19. Communication equipments / contract development of hardware dot.gif
20. Electronics devices circuit design dot.gif
21. Contract software development dot.gif
5 Packing material for products 22. Individual case and carton box for product shipment dot.gif dot.gif
23. Packing material for product shipment dot.gif dot.gif
24. Conductor bags, Plastic bags dot.gif dot.gif
25. Trays dot.gif dot.gif
26. User manuals dot.gif
6 Plant facilities 27. Telecommunication equipments, thick film resistance circuit board, LCD module mounting, assembly facilities dot.gif
28. Facilities in general for various semiconductor assemblies dot.gif



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